Chipset Wars Heat Up: Samsung Goes All-In on Exynos, Qualcomm and MediaTek Chase 5GHz

A dramatic shift in the mobile chipset market is underway, with Samsung doubling down on its own Exynos processors, Apple planning a major process node leap, and a fierce battle between Qualcomm and MediaTek pushing clock speeds to the breaking point.

Samsung: The Exynos Renaissance

A Strategic Pivot

Samsung is dramatically increasing its reliance on in-house Exynos processors for its flagship Galaxy S series, driven by a desire to cut costs and reduce dependence on Qualcomm.

The Exynos 2600, Samsung's first 2nm Gate-All-Around (GAA) SoC, will power select Galaxy S26 and S26+ models, while the Galaxy S26 Ultra sticks with Qualcomm's Snapdragon 8 Elite Gen 5. This marks a major milestone, with the Exynos 2600 projected to account for 25% of all Galaxy S26 series shipments.

The momentum doesn't stop there. The upcoming Exynos 2700 is projected to power 50% of Galaxy S27 shipments, signaling a historic shift in Samsung's internal chip strategy.

The Financial Reality

Samsung reported a staggering $3 billion expense for Qualcomm's Snapdragon 8 Elite chipsets in its Galaxy S25 series alone.

With the Snapdragon 8 Elite Gen 5 costing an estimated $280 per unit, the financial incentive for Samsung to develop its own silicon is clear. The company has publicly stated its intention to reduce reliance on external suppliers and targets its foundry operations to become net-positive in cash flow by 2027.

Cost-Cutting for Galaxy S27

Samsung is exploring aggressive cost management for the Galaxy S27 series:

• Exynos 2700 Packaging: According to Sisajournal, Samsung may exclude Fan-Out Wafer-Level Packaging (FOWLP) from the Exynos 2700—a technology used in the Exynos 2600. Heat would instead be managed through alternative architectures like side-by-side (SBS) chip placement with a heatsink. A final decision is pending.
• Display Sourcing: ZDNet Korea reports Samsung is considering adding Chinese manufacturer BOE as a display supplier for the base Galaxy S27 model to reduce component costs. The partnership is not yet finalized.

TSMC's Roadmap: 1.4nm and Beyond

TSMC is charging ahead with plans that will define the next generation of mobile chips.

• 1.4nm (A14) Node: Mass production is slated for 2028. TSMC claims this node could deliver a 15% performance improvement or 30% power savings compared to its N2 (2nm) node.
• 2nm Node: A "first wave" of 2nm chips arrives in 2026. Apple's iPhone 18 Pro and Pro Max (expected September 2026) are reportedly the first to use this process.
• Sub-1nm Node: Trial production begins in 2029, with an initial target of 5,000 wafers per month.

Apple's Chip Supply Plans

Apple plans to transition from 2nm to 1.4nm chips for high-end iPhones in 2028, with TSMC as the primary supplier for A22 Pro chips.

In a notable shift, Apple is reportedly considering Intel as a secondary chip supplier for lower-end iPad and Mac chips, and possibly non-Pro iPhone chips in 2028. This follows reports of constrained A19 and A19 Pro chip supply from TSMC for the iPhone 17 series.

The Cost of Progress: Memory and Process Challenges

The industry faces significant headwinds:

• DRAM Shortage: Prices have risen 70% , with NAND flash prices up 100% , impacting Galaxy S26 pricing and MediaTek's shipments.
• 2nm Cost Increase: Smart Chip Insider reports that the shift to TSMC's N2P process could increase chipset costs by approximately 20% for next-generation Qualcomm and MediaTek chips.

Qualcomm vs. MediaTek: The 5GHz Arms Race

Qualcomm's Snapdragon 8 Elite Gen 6 Series

Qualcomm is developing two variants of its next flagship:

Snapdragon 8 Elite Gen 6 Pro (SM8975):

• Manufactured on TSMC's 2nm N2P process
• 2+3+3 CPU architecture
• Adreno 850 GPU, 18MB GMEM
• Support for LPDDR6 memory, plus 8MB LLC cache
• Target clock speeds up to 5.00GHz
• Estimated cost: over $300 per unit

Snapdragon 8 Elite Gen 6 (SM8950):

• Same 2nm N2P process
• Adreno 845 GPU, 12MB GMEM
• Support for LPDDR5X memory

MediaTek's Dimensity 9600 Series

MediaTek is fighting back with the Dimensity 9600 Pro, tipped by Digital Chat Station on Weibo:

• Also manufactured on TSMC's 2nm N2P process
• 2+3+3 CPU cluster
• Target clock speed of 5.00GHz
• Reported Geekbench 6 scores: Single-core 4,200-4,300, Multi-core 12,000-12,500—outpacing the Dimensity 9500, Apple A19 Pro, and Snapdragon 8 Elite Gen 5 (for Galaxy)

MediaTek's competitive pricing has historically come from using ARM's CPU and GPU designs, but the Dimensity 9600 is expected to be one of its most expensive offerings yet.

The Thermal Wall: Managing 5GHz in a Phone

Samsung's Heat Pass Block (HPB) Technology

Samsung's Heat Pass Block technology, a copper-based heatsink placed directly on the silicon die, is gaining industry attention. First used in the Exynos 2600 (which also used FOWLP), HPB delivered a 16% improvement in thermal resistance.

A rumor from tipster "Fixed-focus digital cameras" suggests Qualcomm may adopt HPB for the Snapdragon 8 Elite Gen 6 Pro and Gen 6 to manage their blistering clock speeds.

The Reality of Thermal Throttling

Target clock speeds of 5.00GHz present significant thermal management challenges in the confined space of a smartphone:

• The Dimensity 9600 Pro may need to throttle to 4.00-4.20GHz under sustained loads due to limited cooling solutions.
• Analysis indicates the Snapdragon 8 Elite Gen 5 required more power than the Apple A19 Pro to achieve its performance levels.

The Clock Speed Divide: A Tale of Two Worlds

Reports from Wccftech highlight a stark divide in chipset capabilities:

Huawei's Kirin 9030, manufactured by SMIC, has not exceeded 3.00GHz—a direct consequence of U.S. trade sanctions enacted in 2019, which prevent the company from using TSMC's advanced nodes. SMIC is limited to a 7nm process with older DUV equipment.

Other Market Developments

Memory Market Shifts

• Samsung LPDDR4 Production Ends: According to ETNews, Samsung is shifting capacity to LPDDR5 and LPDDR5X standards and will not accept new orders for LPDDR4 and LPDDR4X, potentially affecting entry-level and mid-range smartphone suppliers.
• CXMT-GigaDevice Partnership: Chinese DRAM manufacturer CXMT and GigaDevice have agreed to $825 million worth of DRAM purchases—a significant increase—covering DDR3, DDR4, and LPDDR4 memory, potentially filling the gap left by Samsung.

Mobile HBM Development

Samsung is developing a version of High-Bandwidth Memory (HBM) for mobile devices, using FOWLP and vertical copper pillars to stack DRAM dies. This technology, still under development, could be integrated into future Exynos chipsets.

Smartphone Display Sourcing

• BOE: Samsung is considering BOE as a display source for Galaxy S27 models. BOE has previously been a backup supplier for Apple but has faced quality and quantity issues.
• TCL CSOT: Already provides OLEDs for Samsung's mid-range Galaxy A57.