M5 MacBook Pro: Flexible Cores & a Unified Chip Design?

Speculation suggests that forthcoming M5 Pro and M5 Max MacBook Pro models could offer more flexible CPU and GPU core choices. This concept appears to be supported by a recent update to Apple's website.

A new report further proposes that the M5 Pro and M5 Max may not be two distinct chips but rather different configurations of a single chip design.

The M5 Pro and M5 Max may not be two distinct chips but rather different configurations of a single chip design.

Background: The New Chip Design Approach

Previous reports indicated that Apple plans to use a new chip packaging process for more powerful M5 variants. Specifically, the M5 Pro, Max, and Ultra are expected to utilize server-grade SoIC packaging, known as 2.5D packaging or SoIC-mH (molding horizontal).

This technology aims to improve production yields and thermal performance by featuring separate CPU and GPU designs. This separation of CPU and GPU cores could enable greater flexibility in purchasing. For example, users could select a base CPU configuration while maximizing GPU cores for graphics-intensive tasks.

Apple's recent website change, which shifted from customizable pre-configured options to direct specification configuration, supports the theory of increased flexibility.

The Single Chip Theory Emerges

YouTuber Vadim Yuryev observed the absence of an M5 Pro chip in a recent beta code leak. Based on this, he theorizes that Apple's new 2.5D chip technology allows a single M5 Max chip design to serve for both M5 Pro and M5 Max models.

Apple's new 2.5D chip technology could allow a single M5 Max chip design to serve for both M5 Pro and M5 Max models.

This approach could significantly reduce Apple's costs associated with Stock Keeping Units (SKUs) and design. Under this model, users seeking to maximize both GPU cores and RAM would need to select the M5 Max variant.

This theory is considered plausible, potentially allowing Apple to utilize chip binning more effectively to enhance yields and reduce the need for multiple logic board designs. Confirmation of this innovative design approach is expected following the launch and subsequent teardowns of the new machines.